Upcoming Qualcomm Snapdragon, MediaTek Dimensity chips leaked - Android

Shows what we can expect from phones in the coming months.

The post Upcoming Qualcomm Snapdragon, MediaTek Dimensity chips leaked appeared first on Technobaboy.com.

For most of us, news on mobile processors aren’t really exciting reads. But its an important part of a phone, thus giving us a glimpse on what kinds of smartphones are on the way.

That being said, a leak recently popped up, showing a product road map of Qualcomm and MediaTek processors. The image, lifted from Chinese social media platform Weibo, is from a investment market research report on Qualcomm and MediaTek.

The image shows some interesting things. Among them, the Samsung manufactured Qualcomm chips — specifically the flagship Qualcomm Snapdragon 875G and mid-range Snapdragon 735G. It looks like both chips will be coming in the first quarter of 2021, based on Samsung’s 5nm EUV process.

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Another interesting chip, an unknown Qualcomm “SDM6835” based on a 7nm EUV proces is coming in the third quarter of 2020. There are reports saying this is the Snapdragon 690.

The leak also shows two more Qualcomm chips coming this year, the “SDM 662” and the “SDM 460.” Based on the numbering, we can assume these to for low to mid-range phones.

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The upper portion of the report shows MediaTek’s product road map. You have the 7nm Dimensity 600 coming in the third quarter of 2020, and the 6nm Dimensity 400 which is scheduled sometime between the end of 2020 and the start of 2021. Again, based on naming convention, we’re expecting these to be mid-range and entry-level, respectively.

Its interesting to see how fast chip technology is moving, seeing as we’re about to get entry level and mid-range chips made with 7nm and 6nm process. This usually means we’re about to get more powerful and more efficient phones in the future.

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